微組裝技術﹕MPT/Microelectronic Packaging echnology
混裝技術﹕Mixed Component Mounting Technology
封裝﹕ Package
貼片﹕ Pick and Place
拆焊﹕ Desoldering
再流﹕Reflow
浸焊﹕ Dip Soldering
拖焊﹕ Drag soldering
印制***路﹕Printed Circuit
印制***路﹕ Printed Wiring
印制***路板﹕ printed circuit board
印制***路板﹕printed wiring board
層壓板﹕laminate
覆銅薄層壓板﹕copper-clad laminate
基材﹕base material
成品板﹕production board
印刷﹕printing
導***圖形﹕conductive pattern
印制元件﹕printed component
***面印制板﹕single-sided printed board
雙面印制板﹕double-sided printed board
多層印制板﹕multilayer printed board
***烙鐵﹕ Iron
***風嘴﹕ hot air reflowing noozle
吸錫帶﹕soldering wick
吸錫器﹕tin extractor
焊後檢驗﹕post-soldering inspection
目視檢驗﹕visual inspection
***器檢驗﹕ machine inspection
焊點質量﹕ soldering joint quality
焊***缺陷﹕ soldering jont defect
錯焊﹕ solder wrong
漏焊﹕ solder skips
虛焊﹕ pseudo soldering
冷焊﹕ cold soldering
橋焊﹕ solder bridge
脫焊﹕ open soldering
焊點剝離﹕ solder off
不潤濕焊點﹕ soldering nonwetting
錫珠﹕ solder ball
拉尖﹕ icicle ; solder projection
孔洞﹕ void
焊料爬越﹕ solder wicking
過***焊點﹕ overheated solder connection
不飽和焊點﹕ insufficient solder connection
過量焊點﹕ excess solder connection
助焊劑剩余﹕ flux residue
焊料裂紋﹕ solder crazeing
焊角翹起﹕ fillet-lifting ;lift-off
AI :Auto-Insertion 自動插件
AQL :acceptable quality level 允收水準
ATE :automatic test equipment 自動測試
ATM :atmosphere ***壓
BGA :ball grid array 球形矩陣
CCD :charge coupled device ***視連接元件(攝影***)
CLCC :Ceramic leadless chip carrier 陶瓷引腳載具
COB :chip-on-board 晶片直接貼附在***路板上
cps :centipoises(黏度***位) 百分之一
CSB :chip scale ball grid array 晶片尺寸BGA
CSP :chip scale package 晶片尺寸構裝
CTE :coefficient of thermal expansion ***膨脹系數
DIP :dual in-line package 雙內***包裝(泛指手插元件)
FPT :fine pitch technology 微間距技術
FR-4 :flame-retardant substrate 玻璃纖維膠片(用來***作PCB材質)
IC :integrate circuit 積體***路
IR :infra-red 紅外***
Kpa :kilopascals(壓力***位)
LCC :leadless chip carrier 引腳式晶片承載器
MCM :multi-chip module 多層晶片模組
MELF :metal electrode face 二***體
MQFP :metalized QFP 金屬四方扁平封裝
NEPCON :National Electronic Package and
Production Conference 國際***子包裝及生產會議
ppm:parts per million 指每百萬PAD(點)有多少個不良PAD(點)
psi :pounds/inch2 磅/英吋2
PWB :printed wiring board ***路板
QFP :quad flat package 四邊平坦封裝
SIP :single in-line package
SIR :surface insulation resistance 絕緣阻抗
***C :Surface Mount Component 表面黏著元件
***D :Surface Mount Device 表面黏著元件
***EMA :Surface Mount Equipment
Manufacturers Association 表面黏著設備***造協會
***T :surface mount technology 表面黏著技術
SOIC :***all outline integrated circuit
SOJ :***all out-line j-leaded package
SOP :***all out-line package 小外型封裝
SOT :***all outline transistor ***晶體
SPC :statistical process control 統計過程控制
SSOP :shrink ***all outline package 收縮型小外形封裝
TAB :tape automaticed bonding 帶狀自動結合
TCE :thermal coefficient of expansion 膨脹(因***)係數
Tg :glass transition temperature 玻璃轉換溫度
THD :Through hole device 須穿過洞之元件(貫穿孔)
TQFP :tape quad flat package 帶狀四方平坦封裝
UV :ultr***iolet 紫外***
uBGA :micro BGA 微小球型矩陣
cBGA :ceramic BGA 陶瓷球型矩陣
PTH :Plated Thru Hole 導通孔
IA Information Appliance 資訊家***產品
MESH 網目
OXIDE 氧化物
FLUX 助焊劑
LGA (Land Grid Arry)封裝技術 LGA封裝不需植球,適合輕薄短小產品
應用。
TCP (Tape Carrier Package)
ACF Anisotropic Conductive Film 異方性導***膠膜***程
Solder mask 防焊漆
Soldering Iron 烙鐵
Solder balls 錫球
Solder Splash 錫渣
Solder Skips 漏焊
Through hole 貫穿孔
Touch up 補焊
Briding 穚接(短路)
Solder Wires 焊錫***
Solder Bars 錫棒
Green Strength 未固化強度(紅膠)
Transter Pressure 轉印壓力(印刷)
Screen Printing ***式印刷
Solder Powder 錫顆粒
Wetteng ability 潤濕能力
Viscosity 黏度
Solderability 焊錫性
Applicability 使用性
Flip chip 覆晶
Depaneling Machine 組裝***路板切割***
Solder Recovery System 錫料回收再使用系統
Wire Welder 主***板補******
X-Ray Multi-layer Inspection System X-Ray孔偏檢查***
BGA Open/Short X-Ray Inspection Machine BGA X-Ray檢測***
Prepreg Copper Foil Sheeter P.P. 銅箔裁切***
Flex Circuit Connecti*** 軟性排***焊接***
LCD Rework Station 液晶顯示器修護***
Battery Electro Welder ***池******焊接***
PCMCIA Card Welder PCMCIA卡連接器焊接
Laser Diode 半導體雷射
Ion Lasers 離子雷射
Nd: YAG Laser 石榴石雷射
DPSS Lasers 半導體激***固態雷射
Ultrafast Laser System 超快雷射系統
MLCC Equipment 積層元件生產設備
Green Tape Caster, Coater 薄帶成型***
ISO Static Laminator 積層元件均壓***
Green Tape Cutter 元件切割***
Chip Terminator 積層元件端銀***
MLCC Tester 積層***容測試***
Components Vision Inspection System晶片元件外觀檢查***
高壓恆溫恆濕壽命測試*** High Voltage Burn-In Life Tester
***容漏***流壽命測試*** Capacitor Life Test with Leakage Current
晶片打帶包裝*** Taping Machine
元件表面黏著設備 Surface Mounting Equipment
***阻銀******沾附*** Silver Electrode Coating Machine
TFT-LCD(薄膜***晶體液晶顯示器) 筆記型用
STN-LCD(中小尺寸超扭轉向液晶顯示器 行動******用
PDA(個人數位助理器)
CMP(化******械研磨)***程
研磨液(Slurry),
Compact Flash Memory Card (簡稱CF記憶卡) MP3、PDA、數位相***
Dataplay Disk(微光碟)。
交換式***源供應器(SPS)
*********子***造服*** (EMS),
PCB
高密度連結板(HDI board, 指***寬/***距小於4/4 mil)微小孔板(Micro-via board),孔俓5-6mil以 下 水溝效應(Puddle Effect):早期大面積鬆寬***路之蝕刻銀貫孔(STH)銅貫孔(CTH)
組裝***路板切割*** Depaneling Machine
NONCFC=***氟氯碳化合物。
Support pin=支撐柱
F.M.=光***點
ENTEK 裸銅板上塗一層化******劑使PCB的pad比較不會生鏽
QFD:品質***能展***
PMT:產品成熟度測試
ORT:持續性壽命測試
FMEA:失效模式與效應分析
TFT-LCD(薄膜***晶體液晶顯示器) (Liquid-Crystal Displays Addressed by Thin-Film Transistors)
導***架(Lead Frame):***體導***架(Discrete Lead Frame)及積體***路導***架(IC Lead Frame)二種
ISP的全名是Internet Service Provider,指的是網際網路服***提供
ADSL即為非對稱數位用戶迴路數據***
SOP: Standard Operation Procedure(標準操作手冊)
DOE: Design Of Experiment (實驗計劃法)
打***接合(Wire Bonding)
捲帶式自動接合(Tape Automated Bonding, TAB)
覆晶接合(Flip Chip)
品質規範:
JIS 日本工***標準
ISO 國際認***
M.S.D.S 國際物質安全資料
FLUX SIR 加溼絕緣阻抗值
1. RMA (Return Material Authorization)維修作***
意指產品售出後經由客戶反應***生問題的不良品維修及分析。
Automatic optical inspection (AOI自動光***檢查)
上板机:Loader
下板机:unloader
滴涂器:dispenser
点胶机:dispenser
真空吸笔:vacuum pick & place tool
贴片机:place machine ;chip mounter
波峰焊接机: w***e soldering systems
再流焊炉:reflow soldering systems
自***:self – aligment
位移:skewing
立片: tomb stone
掉片: flying
在线测试:ict;in cricult testing
功能测试:funtion testing
自动光学检测仪:AOI ;automated optical inspection
自动X射线检查: AXI ;automated X-ray inspection
返工工作台: rework station
清洗机:cleaning systems
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