CT-285高导热银胶简介：“KEMITITECT285“是由日本京瓷化学株式会社（KYOCERAchemicalCorporation)生产的一种环氧树脂无溶剂型芯片粘接剂；具有25W/mK的高热导率。由于胶水为低吸湿性的树脂体系，因而具有良好的回流表现。能有效地用于功率集成电路、晶体管。特点：1.由于胶水为单组分无溶剂性，因而具有良好的操作性。2.具有25W/mK的高热导率。3.无爬胶现象。详细介绍：单组份，导热系数25W/mK，适合3-5W大功率LED和模组。自动点胶机适用。IntroductionDieAttachPaste”KEMITITECT285”isepoxyresinbasedandsolventfreeTypepaste.Thehighestthermalconductivity(25W/mK)Goodreflowperformanceduelowermoistureabsorptionresinsystem.CT285iseffectivelyusedforpowerIC,transistor.Features1）Goodworkabilityfordispensingduetosolventfreeandoneliquidtypepaste.2）Highestthermalconductivity(25W/mK)3）Bleedless.GeneralPropertyPropertiesUnitTypicalValueTestMethodAppearance–SilverFilledPasteVisualViscosityat25CPa·s100EHDViscometer0.5rpm3°cone)ThixotropicIndex–6.00.5rpm/2.5rpmNonVoletileWt%92.0180C×2hrSilverContentWt%87.5600C×3hrAdhesiveStrength25c300CN3020Frame:Cu/PPFChipSize:2×2mmVolumeResistivity8×10-6Cure:200C×90minMeasurement:RoomTempGlassTransitionTemperatureC200TMAModulus(25C)25CGPa16.5DMA260C7.8CTEAlpha1Ppm75TMAAlpha2200IonicImpurityNappm61AtomicAbsorptionIonchromatographyCIThermalConductivityW/mK25LaserFlash4.StandardCureCondition175C×60-90min5.RemarksStorageconditionis_30to_15C6month)