星光853BGA智能超大功率BGA拆焊器
853BGA特点:-->星光853BGA智能超大功率BGA拆焊器SUNKKO853BGAIntelligentSuperPowerBGAReworkStation==特式/FEATURE==1)旋转风专利手柄,产生柔和均匀热风。优化直向加热的传统技术,防止局部超高温而使线路板跷曲或BGA起泡等不良影响,有效保护拆焊组件及线路板。1)Patentvortexhandleprovidesevenandsofthotairtoh***ebetterprotectionofcomponentandcircuitboard.It***oidsPCBcrookedorBGAblisterfromtraditionaltechnologyofcentralizingheating.2)采用***的微电脑控制技术,特有轻触界面操作,包括温度设定,时间设定及休眠控制,使操作更安全及可靠。2)AdvancedMCUcontrolhaslighttouchinterfaceincludingtemperaturesetting,timesettingandsleepmodetoachievesafetyandreliableoperation.3)超大功率1500W快速恒温,随开随用。3)Superpower1500Wquickthermostatforinstantuse.4)配合数显温度,时间设定,蓝背***流计,可准确及有效率对芯片进行返修。4)Temperaturedisplay,timesettingandbluelightairflowcontrollettheworkefficientandprecise.5)智能休眠,自动唤醒,自动切源及自动冷却等感应功能,省电环保,安全长寿。5)Intelligentdetectionofautosleep,autoawake,autopoweroffandautocoolingtos***eenergy,environmentprotection,safetyandkeeplonglife.6)真空吸放笔装置,实现零作用力吸放功能,符合BGA免触的特性,无损拆焊的组件。6)VacuumpendeviceisusedtoliftupandplaceBGAfrom/onmainboardtomeetBGAnon-touchnature.7)灵活手柄或主板启动键。7)Flexiblestartcontrolbyhandleorpanel.==SUNKKO853BGA==***高/稳定功率:1500W,600WMax/SteadyPower:1500W,600W控温范围:200~500oCTemperature:200~500oC控时范围:15~999秒Timercontrol:15~999sec开启界面:面板/手柄Startcontrol:Panel/Handle休眠模式:手动/自动Sleepmode:Auto/Manual发热体:1500W陶瓷Heater:1500WCeramic气泵:50W膜片AirPump:50WDiaphragm气流表:蓝背光0.3~23公升/分钟AirflowParameter:Bluelight0.3~23L/min真空吸力:>50gVacuumpower:>50g机身:140(长)225(阔)155(高)毫米Dimension:140(L)225(W)155(H)mm包装:33.5x24x18厘米Packing:33.5x24x18cm毛重:4千克GrossWeight:4kg)