应用领域●Failureanalysis集成电路失效分析●Waferlevelreliability晶元可靠性认证●Devicecharacterization元器件特性量测●Processmodeling塑***测试(材料特性分析)●ICProcessmonitoring制成监控●PackagepartprobingIC封装阶段打线品质测试●Flatpanelprobing液晶面板的特性测试●PCboardprobingPC主板的电性测试●ESD&TDRtestingESD和TDR测试●Microw***eprobing微波量测(高频)●Solar太阳能领域检测分析●LED、OLED、LCD领域检测分析)