IntroductionIndium10.1HFisanairreflow,no-clean,halogen-free,Pb-freesolderpastespecificallyformulatedtoh***eultra-lowvoiding,includingfordesignsthatincorporatelargegroundpadsotherwiseknownasbottomterminationcomponents(BTCs).BTCsincludepackagessuchasQFNs,DPAKs,andMOSFETs.ThefluxchemistryisspecificallyengineeredtoimprovereliabilitybyminimizingvoidingandmaximizingECMandhead-in-pillowperformancewhilealsoprovidingexcellentwetting,solderbeading,solderballing,andslumptomeetIPCspecificati***.Itiscompatiblewithlead-freealloyssuchasSnAgCu,SnAg,andotheralloysystemsf***oredbytheelectronicsindustry.FeaturesUltra-lowvoiding,includingbottomtermination(BTC)assembliesHighECMperformanceunderlowstandoffcomponentsOutstandingsolderbeading,verylowbridging,slump,solderballing,andhead-in-pillowExcellentwettingtofreshandagedcommonmetallizati***andsurfacefinishes,including,butnotlimitedto:OSPImmersionSnImmersionAgENIGExceptionalprinting—hightransferefficiencyandlowvariationHalogen-freeperIEC61249-2-21,testmethodEN14582AlloysIndiumCorporationmanufactureslow-oxidesphericalpowdercomposedofavarietyofPb-freealloysthatcoverabroadrangeofmeltingtemperatures.Type3andType4powdersarestandardofferingswithPb-freealloys.Themetalpercentistheweightpercentofthesolderpowderinthesolderpasteandisdependentuponthepowdertypeandapplication.Standardproductofferingsaredetailedinthespecificati***table.)