1.Features.Halogen-FreeperEN14582testmethod.Hightransferefficiencythrough***allapertures(.0.66AR).Eliminateshotandcoldslump.Highoxidationresistance.WetswelltooxidizedBGAandpadsurfaces.Excellentsolderingperformanceunderhightemperatureandlongreflowprocesses.Clear,probetestablefluxresidue.BackwardcompatiblewithSn/Pballoys2.IntroductionIndium8.9HFisanairreflow,no-cleansolderpastespecificallyformulatedtoaccommodatethehigherprocessingtemperaturesrequiredbytheSn/Ag/Cu,Sn/Ag,andotheralloysystemsf***oredbytheelectronicsindustrytoreplaceconventionalPb-bearingsolders.Indium8.9HFoffersunprecedentedstencilprinttransferefficiencytoworkinthebroadestrangeofprocesses.Inaddition,thehighprobetestabilityofIndium8.9HFminimizesfalsefailuresinICT.)