1.InterfluxIF8300InterfluxIF8300isanoclean,halidefreeandcolophonyfreetackygelfluxwithminimalresiduesaftersoldering.Thefluxprovidesresin-likerheologicalproperties.Itis***ailableindifferentviscositiesfordifferentapplicati***.TheIF8300seriescanbeappliedbyprinting,dispensingorbybrush.TheIF8300gelfluxseriesiscompatiblewithbothlead-freeandleadcontainingalloys.ThefluxexhibitsgoodwettingonvirtuallyallsurfacefinishesincludingOSP,NiAu,I-Sn...etc.Theresiduesareminimalandtransparentanddonotrequireanycleaning.2.InterfluxIF7500HABInterfluxIF7500HABisanoclean,halidefreetackygelfluxwithincreasedactivity.Thefluxprovidesresin-likerheologicalproperties.TheIF7500HABcanbeappliedbyprinting,dispensing,dippingorbybrush.TheIF7500HABgelfluxiscompatiblewithbothlead-freeandleadcontainingalloys.ThefluxexhibitsexcellentwettingonvirtuallyallsurfacefinishesincludingOSP,NiAu,ISn...etc.Theresiduesareminimalandtransparentanddonotrequireanycleaning.3.InterfluxIF8001IF8001isano-cleansolderingfluxdevelopedforselectivefluxingapplicati***ThefluxissuitableforSnPbandlead-freealloys.TypicalprocesseswhereIF8001canbeusedarehandsoldering,touchup,automatedsoldering,andstampsoldering.IF8001canalsobeusedforSnPbBGArework.Thefluxhasnotbeendevelopedforselectivew***eapplicati***.IF8001isabsolutelyhalogenfree,guaranteeingahighreliabilityaftersoldering.Thefluxcontainsalightsyntheticresin,resultinginverycleansolderjoints,ifthefluxisselectivelyappliedonthesolderjointintherightquantity.4.InterfluxIF6000IF6000isano-cleansolderingfluxdevelopedforselectivefluxingapplicati***.IF6000issuitableforSnPbandlead-freealloys.TypicalprocesseswhereIF6000canbeusedarehandsoldering,touchup,automatedsoldering,BGARework,stampsoldering,“waferbumping”,...Thefluxhasnotbeendevelopedforselectivew***eapplicati***.IF6000isabsolutelyhalogenfree.Residuesareverysafe,alsoinanunc***umedstate.Thefluxcontainsnaturalrosin,providingawideworkingwindow.Dependingontheamountoffluxandthetemperatureprofile,thefluxmayle***easlightresidueaftersoldering.)