产品特点■硬件更小更精致、检测速度更快、检测精准度更高■基板传输序列***优化的实现可缩减频率■设备内部空间***优化使用■运用线型的扫描方式实现了无振动、无噪音■各轴承部件的轻量化实现,明显减少了所有发动部分的磨损,可保证设备寿命的***性■减少作业时间技术参数：ModelSIGMAXStandardSIGMAXBlueRSCVII3DSensorCamera(RSCVII传感器相机）MeasuringPrinciple（测量原理）ShadowFreeDualLaserOpticalTriangulation(无阴影双激光光学三角测量)CameraSystem（摄像系统）HighFreeDualRateC-MOSSensor(4MegaPixels)(高双率C-MOS传感器(4百万像素)ScanSpeed(sq.cm/sec)（扫描速度）60X-YResolution(µm)（X-Y分辨率）10×10µmLateralLength(mm)（横向长度）32mmHeightResolution(µm)（高分辨率）0.1µmPasteTypeSupported(Paste类型支持）All(PborPbFree)全部（铅或无铅）BoardTypeSupported(板式支持）AllColorsandAllPads(所有颜色和所有垫子)X-Y-ZRobotSensorHeadMoveinX-Y-ZAxis(在X-Y-Z轴传感器头移动)Performance（性能）HeightRepeatability（高可重复性）3Sigma<1mm,onacertificationtarget(在认证目标上)AreaRepeatability(区域可重复性）3Sigma<1%,onacertificationtarget(在认证目标上)VolumeRepeatability(体积可重复性）3Sigma<1%,onacertificationtarget(在认证目标上)HeightAccuracy(高度***性）2µm,onacertificationtarget(在认证目标上)GageR&R(厚度）<10%Measurement(测量）InspectionType(检测类型）Height,area,volume,offset,shape,balance,warpage,shrink(高度，面积，体积，偏移量，形状，平衡，翘曲，收缩)PCBWarpage（PCB翘曲)+5mm（2%）Min.PasteSize(µm)(***小Paste尺寸）100×100Max.PasteSize(µm）（***大Paste尺寸）20×20Min.PastePitch(µm)（***小Paste间距）80Max.PasteHeight(mm）（***Paste小高度）1000BoardDimension（板尺寸）MinimumSize(mm)（***小尺寸）50×50MaximumSize(mm)（***大尺寸）480×350(3StageConveyorOption:350×350)(三级输送机选择:350×350)BoardThickness（板厚）0.4-5MaximumBoardWeight(kg)（***大板重）2kgTOP/BottomEdgeClearance（顶部/底部边缘间隙）2.5/3.0UndersideClearance(底面间隙）30SystemDimension（系统尺寸）Dimension(W×D×H)（尺寸）Standard:850×1205×1510(3StageConveyorOption:1210×1205×1510(标准:850×1205×1510(三级输送机选择:1210×1205×1510Weight(kg)（重量）800kgConveyorHeight(mm)（输送高度）860-980ConveyorSpeedRange（输送机速度范围）300-1000mm/secFlowDirection（流向）LtoR,RtoLFactorySetting（L到R，R到L工厂设置）ConveyorWidthAdjusting（输送机宽度调整）AutoAdjustable（自动调整）Computer&C***ole（电脑&控制台）CPU(***处理器)i54570,RAM16GBOperatingSystem(操作系统）MS-Windows764bitDisplay（展示）20”LCDEnclosure（外壳）ConformstoCEregulati***(符合CE规定)Supplies（供应）AC220V,5Kgf/sq.cmSoftwareSystem(软件系统）InspectionProgram（检查程序）SPIworksProOfflineTeaching（线下教学）EPM-SPISPC&ProcessMonitoring（程序监控）SPCworksProRemceMachineControl(REMCE机器控制)RMCworksDefectAnalyzer(缺陷分析）AnalyzerProSystemDiagnosis(系统诊断）SPImanagerOpti***(选择）UltraSonicSensor超音速传感器PCBDetectbyUltrasonicSensor(超声波传感器检测PCB）FixedBarcodeSystem(固定条码系统)Top/BottomSideRecognition(Input,OutputConveyor150mmExtension)/1Dor1D+2D(顶部/底部识别(输入，输出输送机150mm延伸)/1D或1D+2D)SensorEmbededBarcodeSystem(传感器嵌入式条码系统)TopsideRecognition(1D+2D)顶部的识别（1D+2D）BackUpPlate(支撑板)BackUpPlate/BackUpPin(BottomClearance25mm)（支撑板/支撑引脚（底部间隙25mm））USP(UnitedStatesPatent美国专利)PCPowerS***e(7-8min)(PC电源节省（7-8min）HDDRAIDSystem(硬盘的RAID系统)HDDMirroringSystem(HDD镜像系统))