1.Features:-Bridge-FreeSoldering-DoesNotContainSilverorBi***uth-EutecticAlloy-Icicle-FreeSoldering-***ooth,BrightWell-FormedFillets-SlowerRateofCopperErosion-DrossRateEqualtoorLowerthanTin-Lead2.Description:AIMSN100C®isalead-freesolderalloydevelopedbyNihonSuperiorinJapan.SN100C®offersuser-friendlypropertiesandhasbeenprovenincommercialproductionsince1999.Theadditionofnickelimprovesthewettingandflowpropertiesofthecosteffectivetin-coppereutectic.Thismakesitpossibletoachieveexcellentresultsinw***esolderingatprocesstemperaturescomparabletothetin-leadsolderitreplaces.Performanceinw***esolderingatleastmatchesthatofmoreexpensivesilver-containingalloysandtheresultingjointsare***ootherandbrighter.SN100C®is***ailableinbar,solidandcoredwire,andsolderpaste.)