富士高速模组贴片机NXTIII 富士贴片机价格
M3IIIM6III対象电路板尺寸(L×W)48mm×48mm~250mm×510mm(双搬运轨道規格)48mm×48mm~250mm×610mm(単搬运轨道規格)※双搬运轨道(W)时***大280mm,超过280mm时変为単搬运轨道搬运。48mm×48mm~534mm×510mm(双搬运轨道規格)48mm×48mm~534mm×610mm(単搬运轨道規格)※双搬运轨道(W)时***大280mm,超过280mm时変为単搬运轨道搬运。元件种类MAX20种类(8mm料帯換算)MAX45种类(8mm料帯換算)电路板加载时间双搬运轨道:连续运转时Osec,単搬运轨道:2.5sec(M3III各模组间搬运),3.4sec(M6III各模组间搬运)贴装精度/涂敷位置精度(以基准***点为基准)※贴装精度是在本公司条件下的测定结果。H24G:&plu***n;0.025mm(标准模式)/&plu***n;0.038mm(生产优先模式)(3σ)cpk≧1.00V12/H12HS:&plu***n;0.038(&plu***n;0.050)mm(3σ)cpk≧1.00H04S/H04SF:&plu***n;0.040mm(3σ)cpk≧1.00H08/H04:&plu***n;0.050mm(3σ)cpk≧1.00H02/H01/G04:&plu***n;0.030mm(3σ)cpk≧1.00H02F/G04F:&plu***n;0.025mm(3σ)cpk≧1.00GL:&plu***n;0.100mm(3σ)cpk≧1.00H24G:&plu***n;0.025mm(标准模式)/&plu***n;0.038mm(生产优先模式)(3σ)cpk≧1.00V12/H12HS:&plu***n;0.038(&plu***n;0.050)mm(3σ)cpk≧1.00H08M/H04S/H04SF:&plu***n;0.040mm(3σ)cpk≧1.00H08/H04/OF:&plu***n;0.050mm(3σ)cpk≧1.00H02/H01/G04:&plu***n;0.030mm(3σ)cpk≧1.00H02F/G04F:&plu***n;0.025mm(3σ)cpk≧1.00GL:&plu***n;0.100mm(3σ)cpk≧1.00产能※产能的数值是在本公司条件下的测定结果。H24G:37,500(生产优先模式)/35,000(标准模式)cphV12:26,000cphH12HS:24,500cphH08:11,500cphH04:6,500cphH04S:9,500cphH04SF:10,500cphH02:5,500cphH02F:6,700cphH01:4,200cphG04:7,500cphG04F:7,500cphGL:16,363dph(0.22sec/dot)H24G:37,500(生产优先模式)/35,000(标准模式)cphV12:26,000cphH12HS:24,500cphH08M:13,000cphH08:11,500cphH04:6,500cphH04S:9,500cphH04SF:10,500cphH02:5,500cphH02F:6,700cphH01:4,200cphG04:7,500cphG04F:7,500cphOF:3,000cphGL:16,363dph(0.22sec/dot)対象元件H24G:0201~5mm×5mmV12/H12HS:0402~7.5mm×7.5mmH08M:0603~45mm×45mmH08:0402~12mm×12mmH04:1608~38mm×38mmH04S/H04SF:1608~38mm×38mmH02/H02F/H01/0F:1608~74mm×74mm(32mm×180mm)G04/G04F:0402~15mm×15mm高度:***大2.0mm高度:***大3.0mm高度:***大13.0mm高度:***大6.5mm高度:***大9.5mm高度:***大6.5mm高度:***大25.4mm高度:***大6.5mm模组宽度320mm645mm机器尺寸L:1295mm(M3III×4,M6III×2)/645mm(M3III×2,M6III)W:1900.2mmH:1476mmDyna工作头(DX)吸嘴数量1241产能(cph)25,000元件有无确认功能ON:24,00011,0004,700対象元件尺寸(mm)0402~7.5×7.5高度:***大3.0mm1608~15×15高度:***大6.5mm1608~74×74(32×100)高度:***大25.4mm贴装精度(以基准***点为基准)&plu***n;0.038(&plu***n;0.050)mm(3σ)cpk≧1.00※※土0.038mm是在敝公司***佳条件下的矩形芯片元件实装(高精度调整)结果。&plu***n;0.040mm(3σ)cpk≧1.00&plu***n;0.030mm(3σ)cpk≧1.00元件有无确认功能○×○元件包装料帯○○○料管×○○料盘×○○元件供应装置智能供料器对应4??8??12??16??24??32??44??56??72??88??104mm宽度料帯管裝供料器4≦元件宽≦15mm(6≦料管宽≦18mm),15≦元件宽≦32mm(18≦料管宽≦36mm)料盘単元对应料盘尺寸135.9×322.6mm(JEDEC规格)(料盘単元-M),276×330mm(料盘単元-LT),143×330mm(料盘単元-LTC)选项●料盘供料器●PCUII(供料托架更换単元)●MCU(模组更换単元)●管理电脑置放台●FUJICAMXAdapter●Fujitrax)