LG高导热硅胶片，具有非常好的高导热率和使用依顺性，在界面缝隙填充材料中具有***的导热率。TheLGserieshighperformance,thermalconductivepaddesignedwithextremelyhighthermalconductivityandfittingperformance,whichisfromtheboronnitridepowderoftherawmaterialcompound,itsthermalconductivityinthethermallyconductivegapfillingmaterialsisunparalleled.特点优势●高可压缩性,柔软兼有弹性,适合于在低压力应用环境●良好的热传导率●电气绝缘●满足ROHS及UL的环境要求●天然粘性典型应用●笔记本电脑●通讯硬件设备●高速硬盘驱动器●汽车发动机控制模快●微处理器，记忆芯片及图形处理器●移动设备物理特性参数表Physicalproperties测试项目Testitem测试方法Testmethod单位UnitLG600测试值LG600valueLG500测试值LG500value颜色ColorVisual蓝色/土红Blue/Laterite***/蓝色Blue/Yellow厚度ThicknessASTMD374Mm0.25~5.00.25~5.0比重SpecificGr***ityASTMD792g/cm32.852.7硬度HardnessASTMD2240ShoreC20/3020/30耐温范围ContinuoususeTempEN344℃-40~220-40~220耐电压VoltageEnduAnceASTMD149KV/mm>5.0>5.0阻燃性FlameRatingUL-9494-V094-V0导热系数ConductivityASTMD5470w/m-k6.05.0基本规格：200mm*400mm，300mm*400mm；可依使用规格裁成具体尺寸。厚度：0.25-5mm。Configurati******ailable:200mm*400mm,300mm*400mm;Customizedsize***ailable)