中兴4GME3860
价格:1.00
产品可广泛应用于路由器,超级本,笔记本电脑,平板,CPE,视频监控等多个领域。*业界当前***薄的TD-LTE模块*采用中兴自研芯片平台,价格优于同类芯片平台*支持LTE多频*支持SIM卡业务*支持IPv4,IPv6协议*高速USB2.0接口*支持HSIC接口*支持短信、数据、电话本、PCM语音功能产品简介ME3860为业界***薄的TD-LTE模块,兼容LGAtypeII封装设计,厚度仅为2.1mm,更加适用于对尺寸要求严格的应用场景。其采用的中兴通讯自研芯片平台Wisefone7510,是国内***通过中国移动LTE多模芯片平台认证的28nm的LTE芯片平台。ME3860支持TD-LTE/TD-SCDMA/G***三模八频,支持R9LTECAT4,下行速率***高可达150Mbps,上行速率50Mbps。产品配置LTETDD:band38,band39,band40,band41TD-SCDMA:band34,band39G***:900MHz,1800MHz产品应用行业应用于路由器,超级本,笔记本电脑,平板,CPE,视频监控等领域。产品优势特点●业界当前***薄的TD-LTE模块●高速USB2.0接口●支持HSIC接口●支持短信、数据、电话本、PCM语音功能●支持IPv4,IPv6协议●支持SIM卡业务●支持LTE多频●采用中兴自研芯片平台,价格优于同类芯片平台GeneralFeatures●LGAFormFactor(108pin)●Dimensi***:36mmx26mmx2.1mm●Weight:approx.4.1grams●Supplyvoltagerange3.4V-4.2V(3.8Visrecommended)●RxDiversity●G***/GPRS/EDGEBand8/Band3●TD-LTE–Band38:2570~2620MHz(Uplink/Downlink)–Band39:1880~1920MHz(Uplink/Downlink)–Band40:2300~2400MHz(Uplink/Downlink)–Band41:2496~2690MHz(Uplink/Downlink)●TD-SCDMA–Band34(A):2010~2025MHz(Uplink/Downlink)–Band39(F):1880~1920MHz(Uplink/Downlink)Electrical&Sensitivity●Tran***itPower:–G***/GPRS900:33&plu***n;2dBm(PowerClass4)–G***/GPRS1800:30&plu***n;2dBm(PowerClass1)–EDGE900:27&plu***n;3dBm(PowerClassE2)–EDGE1800:26-4/+3dBm(PowerClassE2)–TD-LTEBand38+23dBm(Powerclass3)–TD-LTEBand39+23dBm(Powerclass3)–TD-LTEBand40+23dBm(Powerclass3)–TD-LTEBand41+23dBm(Powerclass3)–TD-SCDMABand34+24dBm(Powerclass2)–TD-SCDMABand39+24dBm(Powerclass2)●PowerC***umption:–Standby(Typical):TBD–Maximum:TBDDataFeatures●TD-SCDMA:2.8Mbps●TD-SCDMA:2.2Mbps●TD-LTE:50M/150Mbps(Uplink/Downlink)●TD-LTEBandwidthSupported:5M,10M,15M,20M●TD-SCDMAProtocolSupported:Rel9●LTEProtocolSupported:Rel9●TCP/IPProtocolSupported:IPv4,IPv6,IPv4/IPv6DualStack***SFeatures●SupportTextandPDUmode●PointtopointMOandMT●***SStatusReport***Scentreaddresssetting●Managementof***S:read,write,send,receive,delete,storagestatus,***Slist,new***SalertInterfaces●USB2.0Highspeedinterface●SIMcardinterface(1.8/3.0VDC)●UARTinterface●RFInterface(padforPrimaryandDiversity)●Power-on/Power-off●PCMInterface●LEDInterface●I2CInterface●InteractiveInterface●Reset●HSICInterfaceApplicati***●NDIS●ECM●***S●MMS●Phonebook●STK●USSD●ControlViaATCommandsDriver&Tools●Improvedpower-s***ingmode●NDIS/USBDriver:WindowsXP,WindowsVista,Windows7●ECM/USBDriverforDevices:basedonLinux&AndroidEnvironmental●Operationtemperature:-20°Cto+60°C●Extremeworkingtemperature:-30°Cto+70°C●Storagetemperature:-40°Cto+85°C●Humidity:5%~95%)