Withthistechnology,theLEDchipsareintheformofasemiconductorchip(die)sizebetween100~200micron.TheindividualchipsareplacedontheceramicsubstratePCBandusingtheWireBondingmethod,connectedtothecontactsurfaceoftheceramicsubstratePCB.Goldwiresinthemicrometerrangeareusedforcontactingthesemiconductorchipandthesubstrate.TheCOBtechnologyallowsforvirtuallylimitless***ofscopeforthePCBsandthusservesasthebasisfortotallyuniqueLEDsoluti***.FurthermoreLumiereisusingceramicassubstrateofwhichwillimprovetheinternalquantumefficiencyandincreaseheatdissipation.ThecarefuldesignoftheceramicPCBandselectionofqualitydiesinc***equencesminimizeelectricallossesandlightextractiononthediesandimprovetheLEDefficiency.1.高热导陶瓷基板，芯片所产生的热量可迅速通过陶瓷基板向外传导2.高显色指数，高发光效率发光均匀，3.光线柔和，无眩光，无光斑高可靠性，额定工作电流下，5000小时衰减低于3%4..发光均匀，光线柔和，无眩光，无光斑5..组装方便，可自由搭配和组合，无需PCB板，直接接触散热片。)