高频陶瓷迭层电感高频陶瓷迭层电感高频陶瓷迭层电感MultilayerChipInductor－CLSeries■Construction■Features－Aceramicmaterialconstructionforhighfrequencyapplicationupto10GHz－Tighttolerancephysicaldimensions(+/-0.05mm)－TightinductancetoleranceandexcellentQvalue－Availableinthreecompactsizesof0201,0402,0603■Applications－HighFrequencyApplication－CellularPhone－EMICountermeasureinHighFrequencyCircuitsandComputerCommunicationetc.－WLANandRFmodule①CeramicMaterial③InnerElectrode(Ag)⑤DirectionMark②ThroughHole④End-termination(Ag/Ni/Sn)■DimensionsTypeSize(Inch)LWTA(min./max.)Weight(g)1000pcs)CL0102010.6±0.030.3±0.030.33max.0.1/0.20.28CL0204021.0±0.100.5±0.100.5±0.100.1/0.30.98CL0306031.6±0.150.8±0.150.8±0.150.2/0.33.47■PartNumberingCL02JT10NProductTypeDimensions01:020102:040203:0603InductanceToleranceJ:±5%K:±10%S:±0.3nHPackagingCodeT:TapingReelInductance1N0:1.0nH39N:39nHR10:100nH■ElectricalSpecificationsCL01MultilayerChipInductorsTypeInductance(nH)ToleranceQualityFactormin.L/QFreq.(MHz)Q(Typical)Freq.(MHz)SRF(GHz)min.DCR(Ω)max.IDC(mA)max.1005008000.3±0.3nH410051318100.072500.4±0.3nH410051318100.072500.5±0.3nH410051318100.082500.6±0.3nH410051318100.082500.7±0.3nH410051318100.092500.8±0.3nH410051318100.102500.9±0.3nH410051318100.102501±0.3nH410051519100.142501.1±0.3nH410051519100.142501.2±0.3nH410061520100.142501.3±0.3nH410061520100.142501.5±0.3nH410061520100.182301.6±0.3nH410061520100.182301.8±0.3nH410061520100.192002±0.3nH4100615208.80.202002.2±0.3nH4100615208.80.222002.4±0.3nH4100615208.30.242002.7±0.3nH5100616207.70.252003±0.3nH5100616207.20.281803.3±0.3nH5100616206.70.30180CL01MultilayerChipInductorsTypeInductance(nH)ToleranceQualityFactormin.L/QFreq.(MHz)Q(Typical)Freq.(MHz)SRF(GHz)min.DCR(Ω)max.IDC(mA)max.1005008003.6±0.3nH5100616206.40.301703.9±0.3nH5100716206.00.301704.3±0.3nH5100716高频陶瓷迭层电感高频陶瓷迭层电感高频陶瓷迭层电感)