JetEtchCuProtect是在基础版的JetEtchPro上增加了专利技术以保护芯片内部的铜线在化学蚀刻过程中不受到损害。在化学蚀刻的过程中，JetEtchCuProtech会在芯片的铜线表面形成离子层，从而保护铜线被强酸所腐蚀。美国Nisene科技集团有限公司从事集成电路失效分析的自动开封装置研发超过40年，拥有多项电化学及微波等离子开封机技术的专利。CuProtect工艺-美国专利8,945,343B2-用施加的电压解封装。具有铜线防护的化学芯片开封系统----JetEtchProCuProtectProtectingThoseSensitiveCopperWires.Itjustgoteasier.Withthepriceofgoldatanall-timehigh,acurrenttrendinthemanufacturingofintegratedcircuitsistheshiftfromgoldtocopperbondwires.Withthisshift,thefailureanalystoftheseprocessorsisnowchallengedtosuccessfullyattainpackagedecapsulationbyuseoftraditionalmethods.主要特征（Features）:PatentedBiasTechnologyAdvancedSoftwareAffordableAllJetEtchProFeaturesTheOldMethods.Historically,onewoulduseanautomatedchemicaldecapsulationsystemtoetchsampleswithcopperwires—withminimalsuccess.Evenwithalow-temperaturenitricandsulfuricacidmixture,andevenincombinationwithlaserpre-opening,thisprocessworkstoanextent,butislargelyunreliable.Whenfacedwithalimitednumberoffieldfailures,whichisacommonscenarioinafailureanalysislaboratorysetting,lessreliableprocessescan’tbecountedontodeliversatisfactoryfailureanalysisandvisualinspectionresults.TheSolution.Tosupportmanufacturersinmakingthisshiftsothatfailureanalysiscanstillbeperformedontheirmostadvancedandcuttingedgeproductswhichnowusecopperwirebonding,NiseneTechnologyGrouphasdevelopedaversionofitsnewJetEtchProdecapsulationsystemthatisspecificallydesignedtohandletheprocessingofthissensitivematerial:theJetEtchProCuProtect—thelatestinaseriesofinnovativesoluti***forthefailureanalysisindustryfromNisene.TheProcess.Usingaproprietaryandpatentedprocess,theJetEtchProCuProtectappliesabiastothesolutionbeingpumpedtothesampleintheprocesschamber.Thisbiascreatesaconditioninwhichnegatively-chargedsulfatei***areattractedandtemporarilybondtothesurfaceofthecopperwirewhilethesampleisbeingetched.Thistemporarysulfateioncoatingprotectsthecopperwiresfromcorrosionwhilethesampleundergoestheetchingprocess.Theimagetotherightillustratestheoperatingprincipalbehindthetechnique.Clickontheimagetoopenalargerversioninanewwindow.Inlesssophisticatedsystemsrelyingsolelyonlowtemperatureetching,positively-chargedhydrogeni***areattractedtothecopperwires,therebymakingthewiressusceptibletopitting,cracking,breaking,andmanyotherundesirableanomalousartifactsthatgreatlyaffectorevensquelchcompletelytheabilitytoperformfailureanalysisaftertheetchingprocess.TheNiseneTechnologyGroupCuProtectsystemsolvesthisproblem.TheResults.Asillustratedintheimagesbelow,theadvancedbiasapplicationprocessyieldsresultsthatareunmatchedintheindustry.IfyouwouldliketoseemoreexamplesofsamplesetchedwiththeCuProtect,pleasecontactus.TheSoftware.“Surelysomethinglikethismustbecomplicatedtouseanddifficulttounderstand—right?”youask.Theanswertothatis“ofcoursenot!”ThesystemappearsontheoutsidetobethesameastheJetEtchPro,butthereisanaddedlineinitsdecapsulationprogrammingmenuthatallowstheusertochangethevalueoftheappliedbias.Therangeis0V(offornobias)to20.0V,selectablein.1Vincrements.TheotherdifferencesbetweentheCuProtectsystemandtheJetEtchPro—bothinha***areandsoftware—arehiddeninsidethesystem,sooperatingtheCuProtectisexactlylikeJetEtchProandvirtuallytransparenttoauser.Thatistosay:learningcurveisvery***all.There’snoneedtolearnanythingnewotherthanhowmuchvoltagetoapplytoyoursamplewhileitisetching.Oneadditionalparameterline.Notmuchtolearnhere!)