加工定制：是材质：银用途：厚膜电路，集成电路，电阻网路加工定制：是用途：厚膜电路，集成电路，电阻网路产品名称导电银浆型号/规格ST-01H品牌赛雅颜色***粒度其他（目）CAS435668799钯银导体浆料，适用于厚膜混合集成电路及电阻网络、高压聚焦电位器、高压电阻器等型号ProductNO主要导电相成分MainCompositi***烧结温度（℃）FiringTemp（℃）特性CharacteristicsST-01HAg850印刷性好、附着力强、低成本Highprintability、Highadhesion、LowcostST-02HAg/Pd65/35印刷性好、抗焊料侵蚀性好、高可靠性Highprintability、Highsolderleachingresistance、HighreliabilityST-02HAg/Pd80/20抗焊料侵蚀性好、稳定性好Highsolderleachingresistance、HighresistancetoAgmigrationST-02HAg/Pd85/15印刷性好、可焊性好、附着力强Highprintability、Excellentsolderability、HighadhesionST-02HAg/Pd90/10印刷性好、附着力强、重烧稳定性好Highprintability、Highadhesion、MinimaladhesionaftertheheatcycleST-02HAg/Pd95/5印刷性好、可焊性好、细线分辨率高Highprintability、Excellentsolderability、ExcellentlineresolutionST-02HAg/Pd97/3印刷性好、可焊性好、附着力强Highprintability、Excellentsolderability、HighadhesionST-02HAg/Pd99/1印刷性好、附着力强、低成本Highprintability、Highadhesion、Lowcost)