AlphaRF800Tfluxisformulatedtobeappliedwithfoam,w***e,sprayandmistfluxers.Fluxdeposition,densityanduniformityarecriticaltosuccessfuluseoflowsolidsno-cleanflux.ApplyingRF800Ttoadryfluxcoatingdensityof100to300microgramspersquarecentimetreisrecommended.Preheatingthecircuitassemblywillpartiallydrytheflux,enhanceoxideremovalandpromoteoptimumwicking,aswellassuperiorsolderjointformation.Degreeofpreheatisdependentonmanyvariables;suchasconveyorspeed,typeofcomponentsandsubstrates.Enteringthesolderw***ewithatop-sidetemperatureof90°Cto110°Candabottom-sidetemperatureof120°Cto155°Cistypical.应用：RF800T***助焊剂的涂敷可用发泡、波峰、喷雾和雾化形式。助焊剂涂层的密度和均匀性，对免洗助焊剂成功地被应用是具关键性的影响。建议用密度为500到1500微克/平方英寸干的助焊剂涂层。预热使线路板上的助焊剂干燥，增强去除氧化物及优良焊点的形成。预热温度取决于各种因素，比如传送带速度、器件和基板的种类，进入波峰焊时，典型的顶面温度是88-150摄氏度，底面温度是121-163摄氏度。)