ALPHAOM338T45无铅锡膏ULTRAFINEFEATURELEAD-FREESOLDERPASTEDESCRIPTIONALPHAOM-338-T45isalead-free,no-cleansolderpastedesignedforabroadrangeofapplicati***.ALPHAOM-338-T45’sbroadprocessingwindowisdesignedtominimizetransitionconcernsfromtin/leadtoleadfreesolderpaste.Thismaterialisengineeredtodeliverthecomparableperformancetoatinleadprocess.*ALPHAOM-338-T45yieldsexcellentprintcapabilityperformanceacrossvariousboarddesignsand,particularly,withultrafinefeaturerepeatabilityandhigh“through-put”applicati***.OutstandingreflowprocesswindowdeliversgoodsolderingonCuOSPwithexcellentcoalescenceonabroadrangeofdepositsizes,excellentrandomsolderballresistanceandmid-chipsolderballperformance.ALPHAOM-338-T45isformulatedtodeliverexcellentvisualjointco***etics.Additionally,ALPHAOM-338-T45’scapabilityofIPCClassIIIforvoidingandROL0IPCclassificati***ensuresmaximumlong-termproductreliability.*Althoughtheappearanceoftheselead-freealloyswillbedifferenttothatoftin-lead,withmechanicalreliabilityequaltoorgreaterthanwiththatoftin-leadortin-lead-silver.FEATURES&BENEFITSMaximizesreflowyieldforlead-freeprocessing,allowingfullalloycoalescenceatcirculardimensi***as***allas0.25mm(0.010”)with0.100mm(4mil)stencilthickness.Excellentprintc***istencywithhighprocesscapabilityindexacrossallboarddesigns.Printspeedsofupto200mm/sec(8”/sec),enablingafastprintcycletimeandahighthroughput.Widereflowprofilewindowwithgoodsolderabilityonvariousboard/componentfinishes.Excellentsolderandfluxco***eticsafterreflowsolderingReductioninrandomsolderballinglevels,minimizingreworkandincreasingfirsttimeyieldMeetshighestIPC7095voidingperformanceclassificationofClassIII.Excellentreliabilityproperties,halide-freematerialCompatiblewitheithernitrogenorairreflowPRODUCTINFORMATIONAlloys:SA05(95.5%Sn/4.0%Ag/0.5%Cu)PowderSize:Type4.5Residues:Approximately5%by(w/w)PackagingSizes:500gramjars,LeadFree:ComplieswithRoHSDirective2002/95/EC.APPLICATIONFormulatedforbothstandardandfinepitchstencilprinting,atprintspeedsofbetween25mm/sec(1”/sec)and200mm/sec(8”/sec),withstencilthicknessof0.100mm(0.004”)to0.150mm(0.006”),particularlywhenusedinconjunctionwithALPHA®Stencils.Bladepressuresshouldbe0.16-0.34kg/cmofblade(0.9-2Ibs/inch),dependingupontheprintspeed.Thehighertheprintspeedemployed,thehigherthebladepressurethatisrequired.Thereflowprocesswindowwillgivehighsolderingyieldwithgoodco***eticsandminimizedrework.)