粘合材料类型电子元件保质期6（个月）TYPICALPROPERTIESOFUNCUREDMATERIALITEMCONDITIONSPECIFICATIONREMARKSAppearanceVisualInspectionRedpasteRedpasteViscosity(Poise)Malcom,@25?C,30rpm550~650583ThixotropicIndex3rpm/30rpm≥4.05.3SolidContent(wt%)−98~10099.9SpecificGr***ity@4?C1.0~1.41.2CureCondition@120?C≥120sec120sec@130?C≥100sec@150?C≥60secWorkLife@25?C7daysShelfLife@5~10?C,≤40%RH6monthsPHYSICALPROPERTIESOFCUREDMATERIALITEMCONDITIONSPECIFICATIONREMARKSCorrosion40?C,95%RH,96HoursNotOccurredMoistureAbsorption（wt%）40?C，H2O，24Hours≤1.0TensileStrength(kgf/cm?2;)20~25?C,PCB(FR-4)≥120InsulationResistance(Ω)40?C,95%RH,96Hours≥1×1012DielectricC***tant(1MHz)−≤4.0DissipationFactor(1MHz)−≤0.05GlassTransitionTemperature(Tg,?C)DSC≥80CoefficientofThermalExpansion(CTE,ppm/?C)TMAa1:60(PreTg)a2:195(PostTg)ThermalResistance(sec)245~285?C11~15WithstandingVoltage(kV)40?C,95%RH,72Hours1.8~2.2ChemicalResistanceIPA,25?C,24Hours≤0.1AdhesionStrength(2012Chip)20~25?C，PCB（FR-4）≥2.0HardnessShoreD80~90)