ThermalPadTypicalApplicati***:-BetweenelectroniccomponentssuchasSemiconductor,IC,CPU.MOSandheatsink.-LedLighting,LCDTV,Telecomdevice,wirelessHub,NB,PC,powersupplyetc-CoolingModule,Thermalmodule,inallapplicati***whereametalhousingisusedasheatsink.SpecificationSheet:TypicalPropertiesofK100PropertiesUnitsMetricValueTestMethodC***truction&Composition----Silicone&Ceramicfilled----Color----DarkBlueVisualThicknessRangemm0.5~12.0ASTMD374HardnessShoreC25ASTMD2240Densityg/cc2.2ASTMD792TensileStrengthKN/m0.75ASTMD412Elongation%90%ASTMD412ContinuousUseTemp-40to150EN344BreakdownVoltageKv/mm≥4.0ASTMD149VolumeImpedanceohm-cm1.5*1016ASTMD257DielectricC***tant1MHz4.87ASTMD150WeightDaminify----≤0.5@150240HFlameRating----V-0UL94ThermalConductivityW/m.k1.0ASTME1461UL,RoHS,REACH----Compliance----)