ThermalpadApplicati***:-BetweenelectroniccomponentssuchasSemiconductor,IC,HighperformanceGPU.MOSandheatsink.-LedLighting,LCDTV,LEDBacklightTV,Powersupplyetc-Telecomdevice,WirelessHub,MemoryModules,RAMIC,inallapplicati***whereametalhousingisusedasheatsink.Specificationsheet:TypicalPropertiesofK150PropertiesUnitsMetricValueTestMethodC***truction&Composition----Silicone&Ceramicfilled----Color----DarkGrayVisualThicknessRangemm0.5~12.0----HardnessShoreC25ASTMD2240Densityg/cc2.5ASTMD792TensileStrengthKN/m0.5ASTMD412Elongation%70%ASTMD412ContinuousUseTemp°C-40to150EN344BreakdownVoltageKv/mm≥5.0ASTMD149VolumeImpedanceohm-cm8.0x1015ASTMD257DielectricC***tant1MHz5.75ASTMD150WeightDamnify----≤0.3%@150°C240HFlameRating----V-0UL94ThermalConductivityW/m.k1.5ASTME1461UL,RoHS,REACH----Compliance)