TypicalApplicati***:-BetweenelectroniccomponentssuchasSemiconductor,IC,CPU.MOSandheatsink.-LedLighting,LCDTV,Telecomdevice,wirelessHub,NB,PC,powersupplyetc-CoolingModule,Thermalmodule,inallapplicati***whereametalhousingisusedasheatsink.SpecificationSheet:TypicalPropertiesofK200PropertiesUnitsMetricValueTestMethodC***truction&Composition----Silicone&Ceramicfilled----Color----DarkGrayVisualThicknessRangemm0.5~6.0----HardnessShoreC25ASTMD2240Densityg/cc2.79ASTMD792TensileStrengthKN/m0.33ASTMD412Elongation%78%ASTMD412ContinuousUseTemp-40to150EN344BreakdownVoltageKv/mm≥6.0ASTMD149VolumeImpedanceohm-cm1.1*1016ASTMD257DielectricC***tant1MHz5.75ASTMD150WeightDaminify----≤0.3@150240HFlameRating----V-0UL94ThermalConductivityW/m.k2.0ASTME1461UL,RoHS,REACH----Compliance----)