铝基板|散热铝基板|COB铝基板
价格:1.00
新高集团高导热铝基板规格/特性/结构測試項目Item实验条件Conditi***典型值(TypicalValue)CPCA標準ASH-GASH-HASH-S--剝離強度PeelStrength(kgf/cm)A≧1.5≧1.5≧1.01.05After230℃10min≧1.2≧1.2≧0.80.7耐焊锡性SolderResistance300℃2mindipping不分层,不起泡Nodelaminationandnobubble288℃2min絕緣擊穿***壓DielectricBreakdownVoltage(kV)ASTMD149(TestconditionA)≧4.6≧4.6≧4.0≧2.0热阻ThermalResistance(℃/W)ASTMD5470≦0.18≦0.18≦0.08--热阻抗Thermalimpedance(℃*cm2/W)ASTMD5470≦1.8≦1.8≦0.5≦2.0導***係數ThermalConductivity(W/mk)ASTMD5470≧1.0≧2.0≧1.0--表面电阻SurfaceResistance(Ω)C-96/35/90≧1012≧2×1012≧2×1012≧1010体积电阻VolumeResistance(Ω)≧1013≧7×1013≧6×1013≧1012介***常數Dk1MHzC-24/23/50≦5.0≦4.3≦4.3--介質損耗Df1MHz≦0.05≦0.02≦0.02--耐燃性FlammabilityUL94V0PassPassPassPassCTI(Volt)IEC60112600600600Ⅰ級)
新高电子材料(中山)有限公司
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