ALPHASLS65H免清洗助焊剂Alpha’sLoncoSLS65Hwasspecificallydevelopedtoeliminatethetendencyforsolderballingandsolderbridging-twodefectswhicharenormallyassociatedwiththeuseofthechipw***e.Ofalllowsolids(<4%solids),no-cleanfluxes,LoncoSLS65Hexhibitsthelowesttendencyforsolderballgenerationoverawidevarietyofsoldermasks.LoncoSLS65Hshouldbec***ideredforusebyanyassemblerwhohasboarddesignswhicharesensitivetosolderbridging,performspintesting,andwhosespecificationrequiresanextremelylowfrequencyofsolderballs.GENERALDESCRIPTIONAlpha’sLoncoSLS65Hisanactive,lowsolids,no-cleanflux.ItisformulatedwithaproprietarymixtureoforganicveralproprietaryadditivesareformulatedintoLoncoSLS65Hwhichacttoreducethesurfacetensionbetweenthesoldermaskandthesolder;thereby,dramaticallyreducingthetendencyofsolderballgeneration.TheformulationofLoncoSLS65Hisalsodesignedtobemorethermallystable;thereby,reducingtheoccurrenceofsolderbridging.FEATURES&BENEFITS·Thermallystableactivatorsprovidethelowestsolderbridginginalowsolids,no-cleanflux.·Reducesthesurfacetensionbetweensoldermaskandsoldertoprovidethelowestsolderballfrequencyofanylowsolids,no-cleanflux.·Verylowlevelofnon-tackyresiduetoreduceinterferencewithpintestingandexhibitnovisibleresidue.·Cleaningisnotrequiredwhichreducesoperatingcosts.·BellcoreCompliantforlongtermelectricalreliability.APPLICATIONGUIDELINESPREPARATION-Inordertomaintainc***istentsolderingperformanceandelectricalreliability,itisimportanttobegintheprocesswithcircuitboa***andcomponentsthatmeetestablishedrequirementsforsolderabilityandioniccleanliness.Itissuggestedthatassemblersestablishspecificati***ontheseitemswiththeirsuppliersandthatsuppliersprovideCertificatesofAnalysiswithshipmentsand/orassemblersperformincominginspection.Acommonspecificationfortheioniccleanlinessofincomingboa***andcomponentsis5mg/in2maximum,asmeasuredbyanOmegameterwithheatedsolution.Careshouldbetakeninhandlingthecircuitboa***throughouttheprocess.Boa***shouldalwaysbeheldattheedges.Theuseofclean,lint-freeglovesisalsorecommended.Whenswitchingfromonefluxtoanother,theuseofanewfoamstoneisrecommended(forfoamfluxing).Conveyors,fingersandpalletsshouldbecleaned.BioactSC-10SolventCleanerhasbeenfoundtobeveryusefulforthesecleaningapplicati***.Whenfoamfluxing,donotusehotfixturesorpallets.Hotfixtures/palletswilldeterioratethefoamhead.FLUXAPPLICATION-LoncoSLS65Hisformulatedtobeappliedbyfoam,w***eorspraymethods.Whenfoamfluxing,thefoamfluxershouldbesuppliedwithcompressedairwhichisfreeofoilandwater.Keepthefluxtankfullatalltimes.Thefluxlevelshouldbemaintained1inchto1-½inchesabovethetopofthestone.Adjusttheairpressuretoproducetheoptimumfoamheightwithafine,uniformfoamhead.Auniformcoatingoffluxisessentialtosuccessfulsoldering.Whenusingthefoamorw***emethodofapplication,anairknifeisrecommendedafterthefluxingoperation.Anairknifewillhelpensurethatthefluxisuniformlydistributedacrosstheboardandwillremovetheexcessflux.Whensprayfluxing,theuniformityofthecoatingcanbevisuallycheckedbyrunningapieceofcardboardoverthesprayfluxerorbyprocessingaboard-sizedpieceoftemperedglassthroughthesprayandthenthroughthepreheatsection.ParametersTypicalValuesParameters/TestMethodTypicalValuesAppearanceClear,colorlessliquidpH(5%aqueoussolution)3.2SolidsContent,wt/wt2.8%RecommendedThinner425ThinnerAcidNumber(mgKOH/g)21.5-23ShelfLife12MonthsSpecificGr***ity@25°C(77°F)0.802&plu***n;0.003ContainerSize***ailability1,5,and55Gal.PoundsPerGallon6.68BellcoreGR78-CORE,Issue1CompliantYesFlashPoint(T.C.C.)53°F(12°C)IPCJ-STD-004DesignationORL0汉泰电子辅料有限公司是大陆地区***早从事***T工艺研究与制作的贸易商之一。公司具有多年电子行业从业经验，拥有一支高素质的***技术团队，专注服务于***T和PCB工艺制造焊接材料领域，主营阿尔法助焊剂、阿尔法锡膏、千住锡膏、阿米特锡膏、减摩锡膏、KOKI锡膏、铟泰锡膏、田村锡膏、***T贴片红胶、富士红胶、乐泰胶水、锡丝、锡条等***T焊接材料，欢迎来电咨询洽谈，我们将竭诚为您服务。更多产品信息请登录http://)