汉泰电子辅料有限公司是大陆地区***早从事***T工艺研究与制作的贸易商之一。公司具有多年电子行业从业经验，拥有一支高素质的***技术团队，专注服务于***T和PCB工艺制造焊接材料领域，主营阿尔法助焊剂、阿尔法锡膏、千住锡膏、阿米特锡膏、减摩锡膏、KOKI锡膏、铟泰锡膏、田村锡膏、***T贴片红胶、富士红胶、乐泰胶水、锡丝、锡条等***T焊接材料，欢迎来电咨询洽谈，我们将竭诚为您服务。更多产品信息请登录http://AlphaMetalsRF800T免洗助焊剂No-CleanFluxFEATURESBENEFITS•MediumSolidsContent•PinTestable•NonCorrosiveResidues•HighSirAssembliesDESCRIPTIONAlphaRF800Tisalowsolids,no-cleanfluxformulatedwitha***allpercentageofrosinandnon-halideactivators.Thisuniquerosinactivationsystempromotesexcellentwettingtoprotectedcopperandsoldercoatedsurfaces.PostsolderingresidueofAlphaRF800Tisminimal,slightlyglossyandcanbepintestedwithoutremoval.USEAlphaRF800Tfluxisformulatedtobeappliedwithfoam,w***e,sprayandmistfluxers.Fluxdeposition,densityanduniformityarecriticaltosuccessfuluseoflowsolidsno-cleanflux.ApplyingRF800Ttoadryfluxcoatingdensityof100to300microgramspersquarecentimetreisrecommended.Preheatingthecircuitassemblywillpartiallydrytheflux,enhanceoxideremovalandpromoteoptimumwicking,aswellassuperiorsolderjointformation.Degreeofpreheatisdependentonmanyvariables;suchasconveyorspeed,typeofcomponentsandsubstrates.Enteringthesolderw***ewithatop-sidetemperatureof90°Cto110°Candabottom-sidetemperatureof120°Cto155°Cistypical.Thefoamapplicatorsshouldbesuppliedwithcompressedair,freeofoilandwater.Maintainfluxfluidlevelsufficientlyabovetheaeratortoproduceadequatefoamheight.Adjustairpressuretoproduceoptimumheightwithfoamc***istingofuniformbubbles.Theadditionoffluxthinnerswillberequiredtoreplaceevaporativelossesandmaintainthebalanceinfluxcomposition.DuetothelowsolidscontentofAlphaRF800Tflux,specificgr***ityisnotanaccuratemeasureforasses***ent.Monitoringandcontrollingtheacidnumberisrecommendedformaintainingthefluxcomposition.Theacidnumbershouldbecontrolledbetween21and22.Intime,debrisandcontaminantswillaccumulateinrecirculatingtypefluxapplicators.Forc***istentsolderingperformance,disposeofspentfluxinaccordancewithlocalbylaws,rulesandregulati***periodically.Afteremptyingusedflux,thereservoirandapplicatorshouldbethoroughlycleanedwithfluxthinner.Refillreservoirwithfreshfluxandallowafewminutestostabilisebeforeresumingsolderingoperation.Inthistypeoffluxapplicationequipment,replacefluxevery3dayswhereuseddailyforeighthoursormore.AlthoughAlphaRF800Tisdesignedtobeleftontheboard,ifdesired,postsolderingresiduescanberemovedwithAlpha2110saponifier,HydrexDXdetergentoralternativelyasemi-aqueousprocessusingAlphaAutoClean40maybeemployed.Keyfactorsforno-cleansoldering:Startwithcleanboa***andcomponents.Maintainuniformfluxcoating.Separateboa***topreventfluxcarry-over.ParametersTypicalValuesParameters/TestMethodTypicalValuesAppearancePale,yellowliquidRecommendedThinner800TAdditiveSolidsContent,wt/wt5.0ShelfLife18MonthsAcidNumber(mgKOH/g)21.6ContainerSize***ailability20,200LSpecificGr***ity@25°C(77°F)0.800&plu***n;0.003BellcoreTR-NWT-000078,Issue3CompliantYesFlashPoint(T.C.C.)13°CIPCJ-STD-004DesignationB(RO/L1))