ALPHA阿尔法NR330助焊剂阿尔法助焊剂NR330
ALPHANR330无挥发免洗助焊剂VOC-FREE1NO-CLEANFLUXGENERALDESCRIPTIONALPHANR330,formerlabdevelopment#9225,isaVOC-freehalide-free,rosin/resin-free,lowsolidsno-cleanfluxwhichprovidesthehighestactivityofanyVOC-freeBellcorecompliantfluxfordefect-freesoldering.Itisformulatedwithaproprietarymixtureoforganicactivatorswhichdeliverexcellentwettingandtop-sideholefill,evenwithOSPcoatedbarecopperboa***whichh***eundergonepriorthermalexcursi***.SeveralproprietaryadditivesarealsoformulatedintoALPHANR330whichacttoreducethesurfacetensionbetweenthesoldermaskandthesolder;thereby,dramaticallyreducingthetendencyofsolderballgeneration.TheformulationofALPHANR330isalsodesignedtobemorethermallystable;thereby,reducingtheoccurrenceofsolderbridging.FEATURES&BENEFITS•Bellcorecompliantforassembliesrequiringthisstandard.•VOC-freetohelpmeetairqualityregulati***.•Exceptionalwettingforexcellenthole-fillevenwithorganicallycoatedbarecopperboa***,withpriorreflows.•Thermallystableactivatorsprovidelowsolderbridging.•Reducesthesurfacetensionbetweensoldermaskandsoldertoprovidelowsolderballfrequency.•Verylowlevelofnon-tackyresiduetoreduceinterferencewithpintestingandgoodboardco***etics.•Suitableforusewithlead-freealloyssuchas99.3Sn/0.7Cuand96.5Sn/3.5Ag.APPLICATIONGUIDELINESPREPARATION-Inordertomaintainc***istentsolderingperformanceandelectricalreliability,itisimportanttobegintheprocesswithcircuitboa***andcomponentsthatmeetestablishedrequirementsforsolderabilityandioniccleanliness.Itissuggestedthatassemblersestablishspecificati***ontheseitemswiththeirsuppliersandthatsuppliersprovideCertificatesofAnalysiswithshipmentsand/orassemblersperformincominginspection.Acommonspecificationfortheioniccleanlinessofincomingboa***andcomponentsis5µg/in2maximum,asmeasuredbyanOmegameterwithheatedsolution.Careshouldbetakeninhandlingthecircuitboa***throughouttheprocess.Boa***shouldalwaysbeheldattheedges.Theuseofclean,lint-freeglovesisalsorecommended.Conveyors,fingersandpalletsshouldbecleaned.BioactSC-10SolventCleanerhasbeenfoundtobeveryusefulforthesecleaningapplicati***.FLUXAPPLICATION-NR330isformulatedtobeappliedbyspraymethod.Whensprayfluxing,theuniformityofthecoatingcanbevisuallycheckedbyrunningapieceofcardboardoverthesprayfluxerorbyprocessingaboard-sizedpieceoftemperedglassthroughthesprayandthenthroughthepreheatsection.PhysicalPropertiesTypicalValuesParameters/TestMethodTypicalValuesAppearanceClear,ColorlessLiquidpH2.35SolidsContent,wt/wt4.0RecommendedThinnerDIWaterSpecificGr***ity@25°C(77°F)1.013&plu***n;0.003ShelfLife18monthsAcidNumber(mgKOH/g)38.0&plu***n;2.0ContainerSize***ailability1,5and55Gal.FlashPoint(T.C.C.)NONEIPCJ-STD-004DesignationORL0汉泰电子辅料有限公司是大陆地区***早从事***T工艺研究与制作的贸易商之一。公司具有多年电子行业从业经验,拥有一支高素质的***技术团队,专注服务于***T和PCB工艺制造焊接材料领域,主营阿尔法助焊剂、阿尔法锡膏、千住锡膏、阿米特锡膏、减摩锡膏、KOKI锡膏、铟泰锡膏、田村锡膏、***T贴片红胶、富士红胶、乐泰胶水、锡丝、锡条等***T焊接材料,欢迎来电咨询洽谈,我们将竭诚为您服务。更多产品信息请登录http://)
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