ALPHANC200免洗助焊剂ALPHANC-200providesthebroadestprocesswindowforano-cleanfluxwithlessthan5%solidscontent.ALPHANC-200isdesignedtoprovideexcellentsolderingresults(lowdefectsrates),evenwhenthesurfacestobesoldered(componentleadsandpads)arenothighlysolderable.ALPHANC-200worksparticularlywellwithbarecopperboa***protectedwithorganicorrosin/resincoatingsandwithtin-leadcoatedPCBs.GENERALDESCRIPTIONALPHANC-200isaveryactive,lowsolids,no-cleanflux.Itisformulatedwithaproprietaryactivatorsystem.A***allpercentageofrosinisaddedforenhancedthermalstability.Theactivatorsaredesignedtoprovidethebroadestoperatingwindowforalowsolids,no-cleanflux,whilemaintainingahighleveloflong-termelectricalreliability.Afterw***esoldering,ALPHANC-200le***esalowlevelofnon-tackyresidue,whichiseasilypenetrableinpintesting.FEATURES&BENEFITS•Highlyactiveforexcellentsolderingandlowdefectrates.•Lowlevelofnon-tackyresiduetoreduceinterferencewithpintesting.•Cleaningisnotrequiredwhichreducesoperatingcosts.•Reducesthesurfacetensionbetweensoldermaskandsoldertosignificantlyreducesolderballfrequency.•MeetsBellcorerequirementsforlong-termelectricalreliability.APPLICATIONGUIDELINESPREPARATION–Inordertomaintainc***istentsolderingperformanceandelectricalreliability,itisimportanttobegintheprocesswithcircuitboa***andcomponentsthatmeetestablishedrequirementsforsolderabilityandioniccleanliness.Itissuggestedthatassemblersestablishspecificati***ontheseitemswiththeirsuppliersandthatsuppliersprovideCertificatesofAnalysiswithshipmentsand/orassemblersperformincominginspection.Acommonspecificationfortheioniccleanlinessofincomingboa***andcomponentsis5μg/in2maximum,asmeasuredbyanOmegameterwithheatedsolution.Careshouldbetakeninhandlingthecircuitboa***throughouttheprocess.Boa***shouldalwaysbeheldattheedges.Theuseofclean,lint-freeglovesisalsorecommended.Whenswitchingfromonefluxtoanother,theuseofanewfoamstoneisrecommended(forfoamfluxing).Conveyors,fingersandpalletsshouldbecleaned.ALPHA***-110andBIOACTSC-10SolventCleanersh***ebeenfoundtobeveryusefulforthesecleaningapplicati***.Whenfoamfluxing,donotusehotfixturesorpallets.Hotfixtures/palletswilldeterioratethefoamhead.FLUXAPPLICATION–ALPHANC-200isformulatedtobeappliedbyfoam,w***eorspraymethods.Whenfoamfluxing,thefoamfluxershouldbesuppliedwithcompressedairwhichisfreeofoilandwater.Keepthefluxtankfullatalltimes.Thefluxlevelshouldbemaintained1inchto1-1/2inchesabovethetopofthestone.Adjusttheairpressuretoproducetheoptimumfoamheightwithafine,uniformfoamhead.PhysicalPropertiesTypicalValuesParameters/TestMethodTypicalValuesAppearancePaleYellowLiquidpH(5%aqueoussolution)3.4SolidsContent,wt/wt4.1RecommendedThinnerALPHA425SpecificGr***ity@25°C(77°C)0.792&plu***n;0.003ShelfLife18monthsAcidNumber(mgKOH/g)15.5IPCJ-STD-004DesignationROL0FlashPoint(T.C.C.)56°F(13°C)BellcoreGR78-CORE,Issue1YesPoundsPerGallon6.6ContainerSize***ailability1,5and55Gal.汉泰电子辅料有限公司是大陆地区***早从事***T工艺研究与制作的贸易商之一。公司具有多年电子行业从业经验，拥有一支高素质的***技术团队，专注服务于***T和PCB工艺制造焊接材料领域，主营阿尔法助焊剂、阿尔法锡膏、千住锡膏、阿米特锡膏、减摩锡膏、KOKI锡膏、铟泰锡膏、田村锡膏、***T贴片红胶、富士红胶、乐泰胶水、锡丝、锡条等***T焊接材料，欢迎来电咨询洽谈，我们将竭诚为您服务。更多产品信息请登录http://)