ALPHA615助焊剂SERIESSuperRMAFluxesGENERALDESCRIPTIONALPHA615fluxmeetsMIL-F-14256requirementsforfluxtypeRMA,makingitsuitableforallMilitaryworkrequiringconformancetoDOD-STD-2000.ALPHA615alsomeetstheIPC-SF-818standardfortypeLR3NC,thelowestfluxresiduecorrositivitycategoryandthehighestsurfaceinsulationresistancerating.ThestandardsolidscontentforALPHA615is37%.Whereuseofalowersolidsfluxisappropriate,suchaswhenw***esolderingsurfacemountboa***,615-25(25%solids)and615-15(15%solids)are***ailable.FEATURES&BENEFITS•MaximumachievableRMAactivity.Veryfastwettingflux.•Verycleanable,evenwithhighpreheat.Nowhiteresidue.•Excellentfoamingproperties.Uniform,c***istentfluxcoverage.•Perfectforhighreliabilityrework.ACTIVITYALPHA615isthemosteffectivesolderingfluxyetdevelopedforachievingexcellentsolderingyieldswithcomplexMilitaryassemblies,whileclearlypassingallrequirementsforanRMA,non-conductive,non-corrosiveflux.Wettingbalanceandsolderspreadtestsarewidelyusedquantitativemeasuresforcomparingfluxactivity.Thefasterthespeedofsolderwetting,asmeasuredbythewettingbalance,andthegreatertheareaofsolderspread,i.e.spreadfactorpercent,themoreefficientthefluxisforpromotingsolderwetting.ThesuperioractivityofALPHA615canbeseenfromthefollowingtestdata:Alpha615BrandABrandBSpreadFactor191.7%90.2%86.8%WettingSpeed20.41seconds0.47seconds0.64seconds1Testconductedusingoxidizedcopperand60Sn/40Pbflowedat500°Ffor15seconds.2Testconductedusingoxidizedcopper,60Sn/40Pbat500°F,5mmimmersiondepthand10secondcycletime.Wettingspeedmeasuredastimeforwettingtoreachequilibrium.ALPHA615hasalsodem***tratedtheabilitytopreventsoldericicleformation,whentestedaccordingtothemethoddevelopedbyPhilips-Eindhoven,Netherlands,“DeterminationoftheFluxEfficiencytoPreventFormationofIcicles(andBridges).”USEALPHA615isdesignedforw***esolderingprintedcircuitassembliesthatmustuseanRMAfluxmeetingmilitaryspecificati***.Whileformulatedtoh***eexcellentfoamingproperties,w***eandsprayfluxing,alongwithvariousreworkapplicationmethodscanalsobeused.AllthreesolidslevelsofALPHA615fluxshouldbemaintainedbyperiodicmeasurementoffluxspecificgr***ity(correctedto77°F)andkepttowithin+0.015and-0.005ofthenominalvalues.Whiletopsidepreheattemperaturesof180-200°FaresufficientforALPHA615fluxactivation,higherpreheatconditi***mayberequiredforassembliesthath***esignificantheatsinkingcharacteristics,orwhenattemptingtominimizethetemperaturegradientthatceramicchipcomponentsseebetweenpreheatandthesolderw***e.Underconditi***ofextremepreheat,mostRMAfluxesbecomeextremelydifficulttocleanaftersoldering,especiallywithmildfluorocarbon-blendsolvents.ALPHA615fluxresiduescleanverywellwitheithermildfluorocarbon-blendsolventsoraqueoussaponifier(Alpha2110).PACKAGINGALPHA615seriesfluxesare***ailablein1,5and55galloncontainers.WriteFluxfluxpensarealso***ailable.HEALTH&SAFETYALPHA615isflammable.Keepawayfromheat,sparksandopenflames.Observestandardprecauti***forhandlinganduse,suchasinwell-ventilatedareasand***oidanceofprolongedorrepeatedcontactwithskin.)