MSC合金名称MSP1公称成分[wt%]Cu:99.3Mg:0.7P:0.005比重8.8热膨胀系数[×10-6/k](20∼300°C)17.3导热性[W/(m•K)](20°C)264电阻[μΩ•m]0.0273电导率[%IACS]63弹性模量[kN/mm2]125抗拉强度[N/mm2](MPa=N/mm2,KSI=N/mm2×0.1451)0390Max.1/4H365∼4501/2H420∼5103/4H.H480∼570EH540∼630SH590Min.ESH.0.2%屈服强度[N/mm2]<公称允许0.2%偏差>(MPa=N/mm2,KSI=N/mm2×0.1451)0-1/4H300∼4101/2H370∼4803/4H.H440∼550EH490∼620SH540Min.ESH.伸长率[%min]<公称50mm的%(=2英寸的%)>0251/4H151/2H103/4H.H7EH5SH-ESH.维氏硬度[Hv]0100Max.1/4H90∼1401/2H120∼1703/4H.H150∼190EH170∼210SH180Min.ESH.)