WISEWS-500系列无卤素助焊膏是依照IEC无卤标准、欧盟《RoHS》标准及美国IPC-TM-650标准，适用于手机PCB,BGA等***D之返修助焊膏,采用全新高***化的高取值的改性松香树脂,润锡速度快,低烟,残留物少且表面绝缘阻抗值高。WS-500为免洗型助焊膏,残留物颜色非常淡,有极高之SIR值,建议用于BGA、CSP等球阵焊点返修及补焊。WISEWS-500SeriesHalogen-freesolderpasteisinaccordancewiththeIECstanda***,theEU"RoHS"standa***andtheUnitedStatesIPC-TM-650standa***,whichisappropriateforcellphonePCB,BGA,***Dreworketc…Usethemodifiedrosinresinwhichhasanewhighantioxidantandhighvalue.Thesolderpasteisofinstantwetting,low***oke,lowresidueandhighsurfaceinsulationresistancevalue.WS-500isofwash-freepropertyandthecoloroftheresidueisverylight.ThesolderpastehasahighSIRvalueandisrecommendedbeingusedforthereworkingandre-weldingofBGA,CSPandothersolderpointsofballarray.)