千住水溶性锡膏，千住水洗锡膏，千住水溶性锡膏M705-515A(8)C1-T8G（无卤素锡膏）１．ScopeThisspecificationcoversthesolderpaste,ECOSOLDERPASTEM705-515A(8)C1-T8G,usinglead-freesolderalloy,usedforwiringconnectionandsoon,ofelectricalandelectronicparts.２．Standard２.１Chemicalcompositionofsolderalloy（Testmethod：STM-9-1）Compositionandimpuritiesareprescribedasfollowingtables.Composition(mass%)Ａｇ3.0&plu***n;0.1/Ｃｕ0.50&plu***n;0.05/Ｓｎ２.２Meltingtemperaturerangeandspecificgr***ityofsolderalloy(Referencevalue)Meltingtemperaturerange℃Approx.217～220)