电工级硅微粉是一种活性硅微粉，用作电器产品环氧树脂绝缘封填料，不仅可大幅度增加填充量而更重要的是对于降低混合料体系的粘度，改善加工性能，提高混合料对高压电器线圈的渗透性，降低固化物的膨胀系数和固化过程中的收缩率，养活混合料与线圈之间的热张差，提高固化物的热、电、机械性能诸方面起到有益作用。随着环氧树脂压力凝胶工艺（APG工艺）的迅速发展，一般硅微粉已无法满足对环氧树脂制品的表面质量、多种嵌件内应力分布均匀的要求。APG工艺专用硅微粉是专门针对环氧树脂压力凝胶工艺的特点，由本公司运用独特工艺进行特殊处理而成，能使环氧树脂制品的表面和内部质量得到改善，提高环氧树脂制品的机械强度，耐热性、耐***性和电器绝缘性能。APG工艺专用硅微粉广泛使用于***成形的触头盒、真空断路器绝缘筒、SF6（六氟化硫）开关壳体、固封真空灭弧室等。电工级硅微粉规格及技术指标:项目规格化学成份%水萃取液(1/10)%憎水性min中位粒径D50um比表面积cm2/ccSiO2水份Fe2O3Al2O3灼烧失量Na+ppmCl-ppmFe3+2+ppm电导率us/cmPH值HDDG-30099.70.100.010.060.1<5<3<3<55.5~7.5/501800-2100HDDG-40099.70.070.010.060.1<5<3<3<55.5~7.5/352100-2300HDDG-60099.70.070.010.060.1<5<3<3<55.5~7.5/232600-2800HDDGH-30099.70.070.010.060.1<5<3<3<55.5~7.5>45501800-2100HDDGH-40099.70.070.010.060.1<5<3<3<55.5~7.5>45352100-2300HDDGH-60099.70.070.010.060.1<5<3<3<55.5~7.5>45232600-2800HDDGH-100099.50.070.010.060.152.6<357>45134800~5000HDDGH-125099.50.070.010.060.152.6<357>45105200~6500HDDGH-250099.50.070.010.060.152.6<357>4556800~7000HDDGH-500099.50.070.010.060.152.6<357>452.59000~9500电子级硅微粉规格及技术指标:项目规格化学成份%水萃取液(1/10)%憎水性min中位粒径D50um比表面积cm2/ccSiO2水份Fe2O3Al2O3灼烧失量Na+ppmCl-ppmFe3+2+ppm电导率us/cmPH值HDJG-30099.80.100.010.060.1<2<3<3<35.5~7.5/501800-2100HDJG-40099.80.070.010.060.1<2<3<3<35.5~7.5/352100-2300HDJG-60099.80.070.010.060.1<2<3<3<35.5~7.5/232600-2800HDJG-125099.80.070.010.060.1<2<3<3<35.5~7.5>45105200-6500HDJG-250099.80.070.010.060.1<2<3<3<35.5~7.5>4556800-7000HDJG-500099.80.070.010.060.1<2<3<3<35.5~7.5>452.59000-9500)