http://www.lm-FastLockICDevelopmentSockets-OverViewveryeasyopen/closemethod,noscrews,notoolsrequired***T,thruholeorcompressionmountBandwidthsupto3GHz(***T)Bandwidthsover10GHz(compressionmount)Integratedaluminumheatsink***ailableLidopeningallowsforfailureanalysis/probingLidopeningallowsforopticalICdevelopmentLowprofileandmountsinIC'sfootprint(***Tmount)Pitchesdownto0.5mm(***Tandthruholemounts)or0.4mm(compressionmount)AnygridFast-LockTypeBGASocketDataSheetMECHANICALDATAContactlife:10,000cyclesmin.Solderability:asperIEC60068-2-58Individualcontactforce:40gramsmax.MATERIALInsulator(RoHSCompliant):HightempplasticorepoxyFR4Terminal(RoHScompliant):BrassContact(RoHScompliant):BeCuELECTRICALDATAContactresistance:<100mΩCurrentrating:500mAmax.Insulationresistance:at500VDC100MΩif0.50to0.80mmpitch500MΩ1.00mmpitchupwa***Breakdownvoltage:at60Hz500Vmin.Capacitance:<1pFInductance:<2nHOperatingtemperature:-55°Cto+125°C;260°Cfor60sec.Thesesocketsare***ailableforalmostanyICpackagestyle,size,lead-countandlead-pitchdownto0.5mmpitch:BGA,MLF/QFN,uBGA,SOIC,QFPandalsocustompackagesordie.Furthermore,thesesocketsprovideflexibilityinthePCBmountingmethod:***T,raised***T,through-hole,orcompressionmount.***T(pintype-30)usesastandardreflowprocesstomountthesocketstothetargetPCB.ThesesocketsmountinthesamefootprintastheIC,buttypicallyrequireamimimumclearanceof6mmbetyondthepackage'speriphery.Insituati***whereadjacentcomponentslieinthisarea,eitherthesocketbodycanbemodifiedtoclearthecomponents,oraspecialraised***T(pintypes-28or-29)pincanbeusedinplaceofthestandard***Tpin.Thesepinsraisethesocketbodyfrom2-5mmabovethePCB.AlthoughthismethoddoesnotrequireanydrilledholesinthetargetPCB,itishighlyrecommendedtoprovidetwosuchplatedholesinordertoaccomodatemountingpegsandgreatlystrengthenthephysicalconnectionbetweenthesocketandPCB.Alternatively,epoxycanbeusedtostrengthentheconnection,butthismoreorlesscreatesapermanentbondbetweenthesocketandPCB.Through-hole(pintype-70)requiresplatedholestobedrilledinthePCBintowhichthepinsofthesocketwillbesoldered.Thisprovidesforaveryrobustandreliableelectricalandmechancialconnection.However,theelectricalperformanceisreducedduetothelongerpinlengths.Thismethodishighlysuitableforburn-inapplicati***.Compression(pintype-90)mountremovestheneedforanysolderingandjustrequiresthesockettobeheldtothePCBviascrews.Thebenefitofthismethodisthatitallowsthecustomertoeasilyattachthesockettothetargetboardinthelab,withouttheextracost,lead-time,andpotentialproblemscausedbysendingtheboardtoanassemblyhouse.However,thismethodrequiresthatthetargetPCBhasmountingholesdrilledtoaccomodatethemountingscrewsandsocketbodyalignmentposts.Furthermore,dependingonthesizeoftheIC,thePCBthickness,etc.,abackingplateisrequiredtoproviderigidityandensurethesocketpinscontactthePCBpads.Thisplatecanusuallybemodifiedtoaccomodateanybacksidecompononents.***T(-28,-29,-30)Through-Hole(-70)Compression(-90)SOCKETBODYVERTICALOFFSETThefollowingtableshowstheverticalclearanceofthesocketbodyfromthePCB.Thisisonlyapplicabletothe***Tmountingstyle.Insituati***wheretheclearanceisinsufficient,orthestandard***Tpinispreferred,itispossibletomodifythesocketbodytoaccomodateforadjacentcomponents.PitchVerticalOffsetUsingSpecialRaised***T(-28)VerticalOffsetUsingRaised***T(-29)VerticalOffsetUsingStandard***T(-30)0.50-0.75N/A2.30.40.84.52.80.61.004.53.20.81.27N/A5.01.2Dimensi***inmmFEATURES&BENEFITSEasilyexchangeICsinyoursystemHighbandwidth:3GHz@-1dB***ailableforanyICpackagestyle:BGA,uBGA,CSP,QFN/MLF,LGA,PGA,SOIC,QFP,customordieAnyleadcount,gridandpackagesizeMinimum0.5mmleadpitchMaximum40gforcepercontactMountstosamePCBfootprintastheIC(noholesrequiredfor***Tversion)Lowprofile:<10mmhighwithICMinimalkeepoutarea:approx.6mmbeyondICsperipheryRaised***Tversion***ailableforliftingsocketoveradjacentcomponentsHeatdissipationvialidcut-outorintegratedheatsinkThermalexpansion,shock&vibrationabsorbedbycontactdesignLGAcontactdesigncanalsobeusedforboard-to-boardconnecti***Standard-processdesign&manufacturing=lowercostandtailoredtoyourneeds)