切割和磨边系统能够对硅、金刚石、宝石、GaAs、GaP、玻璃、陶瓷、Geranium,III-Vmaterials等材料做精密切割和独特的磨边处理，双极磨边和同时正负极磨边、返修、切槽和外型修正EdgeBevelingSystemsperformamultitudeofprecisioncuttingandbevelingprocesseswithexceptionalc***istencyaswellaswithexcellentrepeatabilityonsilicon,siliconcarbide,sapphire,NaG,GaAs,GaP,glass,ceramic,Geranium,III-Vmaterials,andotherhardbrittlematerials.Uniqueprocessesincludedoublepositivebeveling,simultaneouspositiveandnegativebeveling,reworking,grooving,andcontouringaswellasremovingtheepitaxialedgecrown,cuttingdiscs(outsidediameter),andholes(insidediameter).SystemsincludeaMicroSandblastertodeliverac***istentflowofabrasivepowderthroughasapphirenozzle.Thenozzleispreciselypositionedbyasealedslideassemblyforpinpointaccuracyaroundthesubstratewhichissecuredinplacebyarotaryvacuumchuck.Atimerisintegratedtoregulatetheprocessperiodforsplitsecondaccuracy.Withtherotationalconcentricityofthechuckassemblyandtheaccuracyoftheabradingprocess,thecuttingtoadiametertoleranceof0.001"ispossible.TheModelB1isidealforsinglecutoperati***.Pleasespecifythematerialtypetobecutandyourelectricalrequirementswhenrequestingforquote.Inadditiontomanufacturingmicrosandblastingequipment,CrystalMark,Inc.operatesanon-sitejobshopforcompaniesrequiringmicrosandblastingservices.)