特点：上锡、吸锡、打磨、钻孔、点胶、芯片的安装和拆卸等。LED显示温度、密码锁定设定参数；温度自动回降及关闭FeaturesUniversal***TcomponentinstallationandremovalSelf-ContainedsoldercreamdispensingMultilayerrepaircapabilityContinuousautomaticcalibrationAutomatictipoffsetcompensationsystemPik-VacComponentHandlingWand)