SiliconeRubberThermallyConductiveInsulationPadhasanidealfillerblendthatgiveslow-moduluscharacteristicthatmaintainsoptimalthermalperformanceyetstillallowsforeasyhandling.Thenaturaltackonbothsidesofthematerialallowsforgoodcompliancetoadjacentsurfacesofcomponents,minimizinginterfacialresistance.Application:Computerandperipherals·Telecommunicati***·Powerconversion·RDRAMTMmemorymodules/chipscalepackages·Areawhereheatneedstobetransferredtoaframe,·chassis,orothertypeofheatspreaderSpecification:Thickness0.5.mm、1mm、1.5mm、2mm、2.5mm、3.0mm、3.5mm、4.0mm、4.5mm.5.0mm.Note:colorandbackadhesivecanbeoptionalbycustomers.Application:itcanbeappliedinavarietykindofelectronicsforheatradiationandinsulation,suchas:CD-ROM,computer,powersupplier,LEDetc)