项目参数（括号内为公制）备注双面板及多层板***大拼版尺寸32”*20”(800mm*508mm)内层***小线宽/线距4mil/4mil(100um/100um)***小内层焊盘5mil(0.13mm)指焊环宽***薄内层厚度限4mil(0.1mm)内层铜箔厚度1/2oz(17um)不含铜箔外层底铜厚度1/2oz(17um)完成板厚度0.20-4.0mm完成板厚度公差板厚<10mm&plu***n;12%4-8layers4-8层板1.0mm≤板厚<2.0mm&plu***n;8%4-8layers4-8层板&plu***n;10%≥10layers10层板板厚≥2.0mm&plu***n;10%内层表面处理工艺BrownOxide棕氧化层板2~18多层板层间对准度&plu***n;3mil(&plu***n;76um)***小钻孔孔径0.15mm***小完成孔径0.10mm孔位精度&plu***n;2mil(&plu***n;50um)槽孔公差&plu***n;3mil(&plu***n;75um)镀通孔孔径公差&plu***n;2mil(&plu***n;50um)非镀通孔孔径公差&plu***n;1mil(&plu***n;25um)孔电镀***大纵横比10:1孔壁铜厚度0.4-2mil(10-50um)外层圆形对位精度&plu***n;3mil(0.075um)外层***小线宽/线距3mil/3mil(75um/75um)触刻公差&plu***n;1mil(&plu***n;25um)阻焊剂厚度线顶0.4-1.2mil(10-30um)线拐角≥0.2mil(5um)基材上1阻焊剂硬度6H阻焊圆形对位精度&plu***n;2mil(&plu***n;50um)阻焊***小宽度3.0mil(75um)塞油***大孔径0.8mm表面处理工艺HASL、插指镀金、全板镀金、OSP、ENIG金手指***大镀镍厚度280u”(7um)金手指***大镀金厚度60u”(1.5um)沉镍金镍层厚度范围120u”/240u”(3um/6um)沉镍金金层厚度范围2u”/6u”(0.053um/0.15um)阻抗控制及公差50o&plu***n;10%线路抗剥强度≥61B/in(≥107g/mm)翘曲度≤0.5%)