三星eMCPKMQE60013M-B318的详细信息品牌：SAMSUNG/三星型号：KMQE60013M-B318封装形式：221FBGA类型：其他用途：通信功能：存储器导电类型：其他封装外形：扁平型集成度：超大规模>10000速率：1866MbpseStorage密度：16GDRAM密度：16G三星eMCPKMQE60013M-B318eMCPeMCP是基于MCP的产品，存储方案是一颗eMMC芯片加一颗低功耗的DRAM或是MobileRAM。随着手机所用操作系统的程序代码容量变大，特别是随着Android操作系统的广泛流行，智能型手机对存储容量的更高要求，Samsung等厂商开始将eMMC和低功耗DRAM封装在一起，满足手机对较大容量的要求。eMCPLPDDR3容量P/NeMMCLPDDRPIN88KMFNX0012M-B2148GB2DMLC1GBLPDDR3221KMFN60012M-B2148GB2DMLC1GBLPDDR32211608KMFE10012M-B21416GB2DMLC1GBLPDDR3221KMFE60012M-B21416GB2DMLC2GBLPDDR32211616KMQE10013M-B31816GB2DMLC2GBLPDDR3221KMQE60013M-B31816GB2DMLC3GBLPDDR32211624KMGE6001BM-B42116GB2DMLC3GBLPDDR3221KMRE1000BM-B51216GB2DMLC3GBLPDDR32213216KMQX10013M-B41932GB2DMLC2GBLPDDR32213224KMGD6001BM-B42132GB2DMLC3GBLPDDR3221KMGX6001BM-B51432GB2DMLC3GBLPDDR3221KMRX1000BM-B61432GB2DMLC3GBLPDDR32213232KMRD60014M-B51232GB2DMLC4GBLPDDR3221KMRX10014M-B61432GB2DMLC4GBLPDDR3221KMRX60014M-B61432GB2DMLC4GBLPDDR32216432KMRH60014A-B61464GB2DMLC4GBLPDDR3221KMRC10014M-B80964GB2DMLC4GBLPDDR3221eMCPLPDDR4X3224KMDD60018M-B32032GB2DMLC3GBLPDDR4X2543232KMDX6001DM-B42232GB2DMLC4GBLPDDR4X2546432KMDH6001DA-B422T0264GB2DMLC4GBLPDDR4X254KMDH6001DM-B42264GB2DMLC4GBLPDDR4X2546448KM3H6001CM-B51564GB2DMLC6GBLPDDR4X254)