WaferGrinding全自动晶圆研磨GDM300——又称晶圆抛光/晶圆背抛/晶圆减薄WaferGrinding全自动晶圆研磨GDM300概要：GDM300WaferGrindingisafullyautomaticcontinuousdownfeedgrindingmachinewithdualpolishingstati***forincreasedthroughput.Wafersarehandledthroughthemachinebya6-axisrobot,andload/unloadarmsdesignedfor25umcapability.Anoptionaledgetrimmingsystemisrecommendedforeliminatingedgechippingforthinwafers.Chuckspeed,grindingwheel,andgrindspindledownfeedratespeedscanbeusedtomanipulategrinderthroughput,surfacefinish,andwheellife.Atwo-pointin-processgaugemeasuringsystemcontrolswaferthicknessundergrindspindles1and2withanoptionallaserdetectionforamoreprecisionthicknessaccuracy(recommendedfor<50um).Programmableoscillatingpolishheadscanbeprogrammedtomaintainwaferprofile(ttv)inconjunctionwithwiththeoptionalmotorizedspindleangleadjustment.Aftercompletionatgrindandpolish,waferisautomaticallytransferredbyrobottothemounterunitforUVexposure,detape,andmount.Pre-cutDAFfeatureisoptionalwhilesingleDAFisincluded.Coin-stackfeaturemaybeintegrated.Thelocalpolishingunitremovessubsurfacedamageforincreasedwaferdiestrengthandtheabilitytohandlefinalthicknessof25micr***.WaferGrinding全自动晶圆研磨GDM300特长：·Theprocessfrombackgrindingtowafermountingcontinuouslybyfullyautomaticsystem,Whichenabletogrindtill25umthickness.·With2headpolishingstage,throughputisalmostdoublecomparedwith1polishheadsystem.·Builtinedgetrimmingsystemis***ailableasanoptionforthinwaferprocess.·Dualindexsystem,whichpolishingstageandgrindingstageiscompletelyseparated,satisfythecleannessrequiredforTSVandMEMSprocess.·LessthanRa1Aultraluminance,ultramirrorsurfaceispossible.WaferGrinding全自动晶圆研磨GDM300相关产品：衡鹏供应晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/WaferGrindingGNX200BP)