晶圆研磨GNX200BP晶圆背抛——又称晶圆减薄/晶圆抛光（WaferGrinding）GNX200BP晶圆研磨/晶圆背抛概要GNX200BPWaferGrindingisafullyautomaticcontinuousdownfeedgrindingmachine.Wafersarehandledthroughthemachinebyarobot,andload/unloadarms.Twodifferentstati***areusedforwafercleaningafterthefinalgrindstation.Chuckspeed,grindingwheel,andgrindspindledownfeedratespeedscanbeusedtomanipulategrinderthroughput,surfacefinish,andwheellife.Atwo-pointin-processgaugemeasuringsystemcontrolswaferthicknessundergrindspindles1and2.Athree-pointgrindspindleangleadjustmentmechani***isutilizedforeasilymaintainingwaferprofile(ttv);withtheoptionamotorizedadjustment.Aftercompletionatthegrindstation,thewafertransferstoPolishunitautomatically.Thelocalpolishingunitremovessubsurfacedamageforincreasedwaferdiestrength,andtheabilitytohandlefinalthicknessof50micr***.GNX200BP晶圆研磨/晶圆背抛规格Maximumwafer-machiningdiameterofwafer64”or8”GrindingSpindle:BearingtypeAirbearing,maximum3600rpmMotor2.2kw,4P,highfrequencymotorRapidfeedspeed200mm/minGrindfeedspeed1to999μm/minGrindingwheelsize?250mmIndexTable:Numberofworkspindles3WorkspindleBearingtypeMechanicalBearing,orAirBearing(optional)SpeedofWorkSpindles1to600rpmAutomaticSizingDevice:Waferthicknessmeasuringsystem2pointcontactin-processgaugeWaferminimumsettingsize1μmWafersizedisplayrange0to1.2mm;extendedrangesoftware***ailableTableCleaningDevice(Grinderside)Water+CeramicblockWaferCleaningUnit(Grinderside)Water+brush,andspin/rinsedrystationNumberofCassettes2stati***foreachunit(Grinder&Polishunit)Polishhead3KwACservomotorfor10–460rpmOscillationspeed100–8,000mm/min.HeadLoad50–999g//cm2Padsize200mmO.D.Polishtablespeed3KwACservomotorfor50–200rpmVacuumChuckmaterialAluminaceramics(dedicatesizeofwafer)ChuckcleaningBrush+WaterWafercleaningN.C.W+DIwaterforPolishsurface&AirblowspindryGNX200BP晶圆研磨/晶圆背抛相关产品：衡鹏供应GDM300晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/WaferGrinding)