琳得科LINTEC UV膜 琳得科不干胶
价格:189.00
琳得科LINTECUV膜玻璃/晶圆切割ADWILLD系列琳得科不干胶ADWILLD系列膜我公司***代理琳得科ADWILLD系列UV膜,用于玻璃,晶圆,基板,陶瓷片等产品的切割。产品线齐全,价格优势,欢迎来电咨询。Twotypesofbackgrindingtapeare***ailable.TheEserieswhichcanberemovedwithoutplacingstressonthewaferbydecreasingadhesionbyUVirradiation,andthePserieswhichisnon-UVtype.Inaddition,thereistheSseriespeelingtape.Dseries(UVCurableDicingTape)ProductInformationSiWaferBaseMaterial:PVC-POHighExpandabilityAntistaticAnti-chippingHighAdhesionEasyPickUpGlass/CeramicsBaseMaterial:PVC-PETStandardPackageSubstrateBaseMaterial:POStandardAntistaticStealthDicingBaseMaterial:PVC-POStandardWaferwithLCTapeBaseMaterial:POStandardAdwillDseriesisanepoch-makinglineofUVcurabledicingtapeswhosefeaturescanbechangedinordancewithoperationalprocess.Thetape'sstrongadhesionsecureswafersduringdicing,andthenisreducedbyUVirradiationtofacilitatepick-up.Thisdicingtapeisessentialforfull-cutdicingofwaferstoimprovediequality,andfullyapplicabletodiesofmultiplesizes.Secureswaferswithstronginitialadhesiontoensuredicingwithoutanyslippingorpeelingevenfor***alldies.SupportsinstantcontrolofadhesionbyUVirradiation,allowinglargediestobepickedupeasily.Causesnocontaminationbymetali***orbyadhesiveresidueonthewaferbacksidesurface,andnoadverseUVirradiationeffectsonICs.Preventscontactdamageofdieswithsuperbexpandability,whichisnotreducedbyUVirradiation.Offersavarietyoftapegradesrangingfromatapewithreducedtapechipsathighspeed,full-cutdicingtoaspecialtapeforthinwafers.Providesspecialgradesnotonlyforwaferdicingbutalsoforpackage,ceramicorglassdicing.Providesvariousnotonlyforbladedicingbutalsoforlaserdicing.SupportstheadhesivecoatingprocessenvironmentthatmeetsClass100(ANSI209b)standa***.ounttapeAdwillD-seriesspecification)
深圳市宝安区沙井福裕昌电子材料行
姓名: 黄永超 先生
手机: 13554721900
业务 QQ: 814200340
公司地址: 深圳市宝安区沙井街道新桥
电话: 0755-27257580
传真: 0755-27257160